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| Inspection Item | Check PKG, PKG seat state, PKG Rotate, X-Mark |
Die&LED Bonder Vision Module
Outline
The Die / LED Chip on Wafer Bonding with the process equipment to PCB, To perform the Align between Die / LED Chip and PCB Vision Module
| Spec | Resolution | 10㎛ |
| Vision Type | Flying Vision (1000㎜/s) | |
| H/W | Camera | 5 Mega Pixel |
| Lens | Telecentric Lens | |
| Light | Coaxial, Bar Light | |
| Color : Red | ||
| S/W | 알고리즘 | Pattern Match |
| Edge Detection |
BGA Package Inspection Module
| Spec | Resolution | 17㎛ |
| Vision Type | Flying Vision (700㎜/s) | |
| H/W | Camera | 12 Mega Pixel |
| Lens | Telecentric Lens | |
| Light | Coaxial, Ring Light | |
| Color : Red, Green | ||
| S/W | 알고리즘 | Circle Measure |
| Blob Analysis | ||
| Pattern Match | ||
| Edge Detection |
Semiconductor Package Test Handler Inspection Module
Outline
Test Socket and Tray between duly quality inspection.
| Spec | Resolution | 50㎛ |
| Vision Type | Flying Vision (300㎜/s) | |
| H/W | Camera | 5 Mega Pixel |
| Q’ty : 8 ea | ||
| Lens | Telecentric Lens | |
| Light | Bar Light | |
| Color : Red | ||
| S/W | 알고리즘 | Pattern Match |
| Blob Analysis | ||
| Edge Detection |
